✦ LIBER ✦
The influence of post-bond heat treatment on microstructural development in martensite-forming NiAl-NiTi transient liquid phase bonds employing copper interlayers
✍ Scribed by W. F GALE; Y GUAN
- Book ID
- 110373073
- Publisher
- Springer
- Year
- 1997
- Tongue
- English
- Weight
- 545 KB
- Volume
- 32
- Category
- Article
- ISSN
- 0022-2461
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