The influence of organic additives on the thickness distribution of tubular metallized through-holes

✍ Scribed by M. Wünsche; W. Dahms; H. Meyer; R. Schumacher

• Publisher: Elsevier Science
• Year: 1994
• Tongue: English
• Weight: 522 KB
• Volume: 39
• Category: Article
• ISSN: 0013-4686
• DOI: 10.1016/0013-4686(94)e0027-w

✦ Synopsis

Through-hole plating capability was examined for process electrolytes made up with various organic additives Tafel plots were obtained from cyclic voltammetry using the rotating-disc technique The levelling capability of the electrolytes was obtained from couloinetry and in situ microgravimetry in combination with optical microscopy, the throwing power for through-hole plating from the thickness ratio center of hole-plane surface outside the bole . It was shown that a high throwing power correlates with a low levelling capability The results shed some light on the inhibiting character of the process electrolytes used