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The impacts of high tensile stress CESL and geometry design on device performance and reliability for 90 nm SOI nMOSFETs

✍ Scribed by Chieh-Ming Lai; Yean-Kuen Fang; Chien-Ting Lin; Chia-Wei Hsu; Wen-Kuan Yeh


Book ID
108210635
Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
533 KB
Volume
47
Category
Article
ISSN
0026-2714

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