The IC plastic package: a simple method of predicting package performance : Marion C. Halleck. 10th IEEE Annual Proceedings, Reliability Physics (1972), p. 88

• Publisher: Elsevier Science
• Year: 1973
• Tongue: English
• Weight: 110 KB
• Volume: 12
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(73)90399-5