The high-frequency characteristics of tape automated bonding (TAB) interconnects

✍ Scribed by Wentworth, S.M.; Neikirk, D.P.; Brahce, C.R.

• Book ID: 117872624
• Publisher: IEEE
• Year: 1989
• Tongue: English
• Weight: 768 KB
• Volume: 12
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.35480