✦ LIBER ✦

The future for multichip modules

✍ Scribed by M.G. Sage

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Present and future directions for multic

✍ Sudo, T. 📂 Article 📅 1995 🏛 IEEE 🌐 English ⚖ 697 KB

Layer assignment for multichip modules

✍ Ho, J.M.; Sarrafzadeh, M.; Vijayan, G.; Wong, C.K. 📂 Article 📅 1990 🏛 IEEE 🌐 English ⚖ 531 KB

Current capabilities/needs and future po

✍ Johnson, R.R. 📂 Article 📅 1991 🏛 IEEE 🌐 English ⚖ 136 KB

Multichip modules for high performance c

✍ J Tony Pan; Claude Hilbert; Bill Weigler 📂 Article 📅 1990 🏛 Elsevier Science 🌐 English ⚖ 454 KB

A review of planar techniques for multic

✍ Schiltz, A. 📂 Article 📅 1992 🏛 IEEE 🌐 English ⚖ 935 KB

Benzocyclobutene interlayer dielectrics

✍ Johnson, R.W.; Phillips, T.L.; Weidner, W.K.; Hahn, S.F.; Burdeaux, D.C.; Townse 📂 Article 📅 1990 🏛 IEEE 🌐 English ⚖ 780 KB