✦ LIBER ✦
The finite element analysis of internal stresses during sequential build-up of lamination-based thick-film multilayer substrates
✍ Scribed by Jin S. Kim; Kyung W. Paik; Bong K. Kim; Ji H. Lim
- Book ID
- 110270984
- Publisher
- Springer US
- Year
- 2000
- Tongue
- English
- Weight
- 365 KB
- Volume
- 11
- Category
- Article
- ISSN
- 0957-4522
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