✦ LIBER ✦
The feasibility of ultrasonic welding flip chips to thick film conductors : K. I. Johnson, M. H. Scott, W. Battarbee and R. Griggs. IERE Conf. Hybrid Microelectron. Canterbury. 71 (25–27 Sept. 1973)
- Publisher
- Elsevier Science
- Year
- 1974
- Tongue
- English
- Weight
- 107 KB
- Volume
- 13
- Category
- Article
- ISSN
- 0026-2714
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