The Electronic Packaging Handbook

✍ Scribed by John Okyere Attia

• Publisher: CRC Press
• Year: 1999
• Tongue: English
• Leaves: 606
• Series: Electronics Handbook Series
• Edition: 1
• Category: Library

✦ Synopsis

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

✦ Table of Contents

Organization......Page 3
Contributors......Page 5
Contents......Page 6
APPA.PDF......Page 0
1.2.1 Introduction......Page 560
1.2.2 The Process View of Production......Page 563
Quality Function Deployment......Page 564
1.3.2 Systems Engineering Theory and Concepts......Page 566
Functional Analysis......Page 567
Synthesis......Page 568
Evaluation and Decision......Page 569
Description of System Elements......Page 571
Design Development......Page 572
Electronic System Design......Page 574
Budget Requirements Analysis and Project Proposal......Page 577
Project Management......Page 578
Time Control of the Project......Page 580
1.4 Quality Concepts......Page 581
1.4.1 Design of Experiments......Page 583
Multivari Chart......Page 584
Components Search......Page 585
Variables Search......Page 587
Full Factorial Analysis......Page 588
Realistic Tolerances Parallelogram Plots......Page 589
Precontrol......Page 590
1.5.1 Introduction......Page 591
1.5.2 Computers and Types of Documentation......Page 592
Axiomatic Theory of Design......Page 594
Design Guidelines......Page 595
1.7.1 Introduction and Definitions......Page 596
Registration, Europe......Page 597
Registration, U.S.A.......Page 598
1.7.4 Implementation: Process Flow......Page 599
Third Stage......Page 600
Fourth Stage......Page 601
Benefits of ISO 9000......Page 602
1.7.7 ISO 9000 Summary......Page 603
1.9 Reference and Standards Organizations......Page 604
References......Page 606
Product Safety and Third-Party Certification......Page 515
Considerations in the Implementation of SMT......Page 516
2.6.6 Electrically Conductive Adhesives......Page 570
2.3 Surface Mount Device (SMD) Definitions......Page 520
2.5 Thermal Design Considerations......Page 524
2.6 Adhesives......Page 526
2.6.1 Adhesive Characteristics......Page 527
Failure Characteristics during Rework......Page 528
2.6.2 Adhesive Application Techniques......Page 529
Pin-Transfer......Page 530
2.6.3 Dot Characteristics......Page 531
2.6.4 Adhesive Process Issues......Page 533
2.6.5 Adhesives for Thermal Conduction......Page 534
Dielectric Strength, in Volts/Mil......Page 535
Color......Page 536
Shelf Life......Page 537
2.6.7 Adhesives for Other Purposes......Page 538
2.7.1 Solderability......Page 539
2.7.2 Flux......Page 541
Flux Application......Page 542
2.7.3 Solder Paste......Page 543
2.7.4 Paste-In-Hole Technology......Page 545
2.8.2 Moisture Sensitivity of Plastic Packages......Page 546
2.8.3 Part Placement......Page 548
2.9 Reflow Soldering......Page 551
Post-Reflow Inspection......Page 553
2.11 Prototype Systems......Page 554
Terms and Definitions......Page 555
References......Page 556
Other Sources......Page 557
Conferences Directly Related to SMT......Page 558
4.3 Known Good Die......Page 488
4.4 Chip on Board......Page 489
4.5.1 Flip Chip Overview......Page 490
Introduction......Page 493
Flip Chip Benefits......Page 494
The Solder Joint......Page 495
Flip Chip Solder Bump Deposition Processes......Page 496
Benefits and Drawbacks of Printed Solder Bumps......Page 503
Flip Chip Handling and Placement Equipment......Page 506
Fluxes and Underfills......Page 507
Acknowledgments......Page 510
4.6 Chip-Scale Packages......Page 511
Bibliography......Page 513
5.2.1 Board Types, Materials, and Fabrication......Page 458
5.2.2 Design of Printed Wiring Boards......Page 462
5.2.3 PWB Interconnection Models......Page 464
References......Page 471
5.3 Basic Circuit Board Design: Overview and Guidelines......Page 472
5.4 Prototyping......Page 473
5.5 DFM and DFT Issues......Page 474
5.6.1 Board Warpage......Page 477
5.6.2 Board Surface Finishes......Page 478
5.7.1 Grounds......Page 479
Analog Design......Page 480
Digital Design......Page 481
5.8 Simulation......Page 482
5.9.1 Institute for Interconnecting and Packaging Electronic Circuits (IPC)......Page 483
Military......Page 484
References......Page 485
EMC and Printed Circuit Board Design......Page 367
13.1 Introduction......Page 368
Resistors......Page 370
Transformers......Page 371
6.1.2 How and Why RF Energy is Created Within the PCB......Page 372
6.1.3 Concept of Flux Cancellation (Flux Minimization)......Page 376
6.1.4 Common-Mode and Differential-Mode Currents......Page 377
Common-Mode Currents......Page 378
6.1.5 RF Current Density Distribution......Page 381
6.1.6 Skin Effect and Lead Inductance......Page 382
6.1.7 Grounding Methods......Page 384
Single-Point Grounding......Page 385
Multipoint Grounding......Page 386
6.1.8 Ground And Signal Loops (Excluding Eddy Currents)......Page 387
6.1.9 Aspect Ratio—Distance Between Ground Connections......Page 388
6.1.10 Image Planes......Page 389
6.1.11 Slots in an Image Plane......Page 391
6.1.12 Partitioning......Page 392
Fundamental Principles......Page 394
Fundamental Concepts......Page 395
Section 6.1 References......Page 396
6.2.1 Overview on Transmission Lines......Page 397
Microstrip Topology......Page 398
Embedded Microstrip Topology......Page 400
Single Stripline Topology......Page 401
Dual or Asymmetric Stripline Topology......Page 402
Differential Microstrip and Stripline Topology......Page 404
6.2.3 Relative Permittivity (Dielectric Constant)......Page 405
6.2.4 Capacitive Loading of Signal Traces......Page 408
Section 6.2 References......Page 409
6.3.1 Impedance Matching—Reflections and Ringing......Page 410
6.3.2 Calculating Trace Lengths (Electrically Long Traces)......Page 413
Example......Page 414
6.3.3 Routing Layers......Page 415
6.3.4 Layer Jumping—Use of Vias......Page 416
6.3.5 Trace Separation and the 3-W Rule......Page 417
6.3.6 Trace Termination......Page 418
6.3.7 Series Termination......Page 421
6.3.9 Parallel Termination......Page 422
6.3.10 Thevenin Network......Page 423
6.3.11 RC Network......Page 424
6.3.12 Diode Network......Page 425
Section 6.3 References......Page 426
6.4.1 Review of Resonance......Page 427
Series Resonance......Page 428
Impedance......Page 429
Energy Storage......Page 431
6.4.3 Resonance......Page 432
6.4.4 Power and Ground Planes......Page 434
6.4.5 Capacitors in Parallel......Page 435
6.4.6 Power and Ground Plane Capacitance......Page 437
6.4.7 Buried Capacitance......Page 440
6.4.9 Lead-Length Inductance......Page 441
Decoupling Capacitors......Page 442
6.4.12 Calculating Capacitor Values (Wave-Shaping)......Page 446
Method 2......Page 448
6.4.13 Selection of Bulk Capacitors......Page 449
Method 1......Page 450
6.4.14 Designing a Capacitor Internal to a Component’s Package......Page 451
6.4.15 Vias and Their Effects in Solid Power Planes......Page 453
Additional Bibliography/Suggested Readings......Page 454
8.4.2 Mechanical Considerations......Page 341
Functional Materials......Page 342
Binder......Page 344
7.3.2 Screen Printing......Page 345
7.4.1 Deposition......Page 346
7.4.2 Materials......Page 347
7.5 Chip Resistors and Multilayer Ceramic Capacitors......Page 348
7.6 Component and Assembly Packages......Page 349
7.7 Buried Passive Circuit Elements......Page 350
7.8.2 Tape Automated Bonding......Page 351
7.9.1 Multichip Module Technology Definitions......Page 352
7.9.2 Design, Repair, and Test......Page 358
7.9.3 When to Use Multichip Modules......Page 360
7.9.4 Issues in the Design of Multichip Modules......Page 362
References, Sections 7.1–7.8......Page 363
Suggested Readings......Page 364
Where Else?......Page 273
8.1.2 Crosstalk......Page 274
8.2 Wires for Interconnection......Page 275
8.3.2 Terminals for Wire Connections......Page 276
8.4.1 Electrical Considerations......Page 277
8.4.4 Contact Types......Page 281
8.5 Board Interconnects......Page 282
8.6.1 Socket Types......Page 283
8.6.3 Socket Selection......Page 285
8.6.4 Examples of Specific Socket Types......Page 287
8.7.1 Basic Principle of Operation......Page 288
Absorbtion......Page 291
Chromatic Dispersion......Page 292
Fiber Types......Page 294
Fiber Nonlinearities......Page 296
Stimulated Brillouin Scattering (SBS)......Page 297
Four Wave Mixing......Page 298
9.3.3 Boundary-Scan Register Cells......Page 299
Cable Design Considerations......Page 301
Central Member......Page 302
9.3.4 Boundary-Cell Applications......Page 303
Slotted Rod......Page 304
Sheath Options......Page 305
9.4 General Electrical Design......Page 306
Self-Supporting Aerial Cables......Page 307
Applications/Considerations of Outdoor Cables......Page 308
Outdoor Installations......Page 309
National Electrical Code......Page 310
Tight Buffered Premises Cables: General Construction and Overview......Page 311
Loose Tube Premises Cables—General Construction and Overview......Page 312
900-µm Tight Buffer Material......Page 313
Applications of Cables......Page 314
Industrial-Use Cables......Page 315
Fusion Splicing......Page 316
9.5.1 Design for Bed-of-Nails Fixtures......Page 317
Attenuation......Page 318
8.7.7 Defining Terms......Page 320
8.8.2 General Applications......Page 321
8.8.3 Theory......Page 322
8.8.4 Power Handling......Page 323
Where Else?......Page 325
Conductive Removal to Standard Board/Substrate......Page 326
8.8.8 Long Interconnection Applications......Page 327
12.4.5 Fault Distributions......Page 328
8.9.2 Characterization of Passive Elements......Page 329
8.9.3 Transmission Line Sections......Page 331
8.9.5 Impedance Transformers......Page 332
8.9.8 Microwave Resonators......Page 333
8.9.9 Tuning Elements......Page 334
8.9.10 Hybrid Circuits and Directional Couplers......Page 335
8.9.11 Filters......Page 336
Circulators and Isolators......Page 337
Suggested Readings......Page 338
References......Page 339
9.2 Testing Philosophies......Page 248
9.2.2 Loaded Board Tests......Page 249
9.3 Scan Test for Digital Devices......Page 251
9.3.1 Boundary Scan Defined......Page 252
TAP State Diagram......Page 289
Test Access Port Operation Modes......Page 255
Software Comands......Page 257
TAP Hardware......Page 258
Data Registers......Page 259
9.3.5 Support Software......Page 261
9.4.1 General Data Acquisition Considerations......Page 264
9.5 Design for Test Fixtures......Page 265
Definitions and Acronyms......Page 270
References......Page 271
11.2 Overview......Page 220
10.3 General Classification of Adhesives......Page 221
10.4.1 Epoxy Adhesives......Page 222
10.5 Conductive Adhesives for Surface Mounting......Page 223
Anisotropic Electrically Conductive Adhesives......Page 224
11.5.2 Fundamentals of Device Package Thermal Characteristics......Page 225
11.6.1 Heat Removal Techniques......Page 227
10.6.3 Syringing......Page 228
12.7 Environmental Stress Screening......Page 234
10.8 Evaluation of Adhesives with Differential Scanning Calorimetry......Page 237
10.8.1 Basic Properties of DSC Analysis......Page 239
10.9 Summary......Page 243
Where Else?......Page 192
11.3.6 Solids......Page 195
11.3.9 Melting Point......Page 196
Mechanical Hazards......Page 197
Basic Heat Flow Relations, Data for Heat Transfer Modes......Page 199
15.4.3 Chip Capacitors and Ceramic Baseplates......Page 208
Natural Convective Removal......Page 230
Heat Sink Compounds......Page 240
Conductive Removal to Enhanced Board/Substrate......Page 216
References......Page 217
12.2 Testing Philosophies......Page 157
12.3 Test Strategies......Page 160
World Wide Web Related Sites......Page 198
12.4.1 Component Faults......Page 161
12.4.2 Manufacturing Faults......Page 163
12.5 Automated Test Methods......Page 165
12.5.1 Manual Testing......Page 166
12.5.2 PC-Based Testing......Page 233
12.5.5 In-Circuit Analyzer......Page 167
12.5.6 In-Circuit Testing......Page 168
12.5.8 Substitution Testing......Page 169
12.5.10 Fault Coverage......Page 170
12.6 Test Fixtures......Page 171
12.8 Test Software......Page 175
12.9 Testing Software Programs......Page 235
12.9.2 Software Code and Unit Test......Page 177
12.9.5 System Verification Test—Main Phase......Page 180
Engineering Field Trial—Selection of Site......Page 182
Equipment Used for Safety Tests......Page 183
Engineering Field Trial—Execute Field Trial Plan......Page 184
12.9.8 Customer Acceptance Process (Beta Test)......Page 185
System Verification Test—Final Test......Page 186
Defining Terms......Page 187
Abbreviations......Page 188
References......Page 189
Inspection......Page 145
X-Ray Laminography......Page 202
Off-Line Inspection......Page 148
13.4 Solder Joint Inspection Criteria......Page 149
Solder Bridges......Page 150
Solder Voids......Page 152
13.6 Automated Optical Inspection......Page 154
References......Page 155
14.2 Ergonomic Considerations......Page 99
14.3.2 Introduction......Page 100
A1.1 Control Selection......Page 101
A1.1.2 Control-Effect Relationships......Page 102
A1.1.3 Standard Practices......Page 104
Keylock.......Page 105
Detent thumbwheel.......Page 106
Pushbutton.......Page 107
Legend switch.......Page 108
Rocker switch.......Page 110
A1.3 Sets of Numerical Keys......Page 112
Application 14.2 Keys......Page 113
Light signals.......Page 127
Crank.......Page 115
Lever.......Page 116
Design-Rule Checking......Page 119
Printed Circuit......Page 121
A4.2 Preventing Accidental Activation......Page 124
A4.3 Displays......Page 125
Complex displays.......Page 128
14.3.4 Electronic Displays......Page 131
Example......Page 132
Application 14.5......Page 133
A5.2 Control-Display Assignments......Page 134
A5.4 Auditory Signals......Page 136
A5.5.1 Labels......Page 137
A5.5.2 Warnings......Page 138
14.3.6 Challenges......Page 139
14.4 Environmental Issues......Page 140
14.5 Maintenance......Page 141
14.6 Safety......Page 142
References......Page 143
Electronics Package Reliability and Failure Analysis: A Micromechanics- Based Approach......Page 62
16.1 Essential Requirements for Safety......Page 204
Scope and Objects......Page 64
15.2.1 Basic Reliability Concepts......Page 65
Transformers......Page 68
15.2.2 Accelerated Testing......Page 69
15.3 Micromechanisms of Failure in Electronic Packaging Materials......Page 70
Example 15.3......Page 71
Brittle Overload......Page 72
Example 15.4......Page 74
15.3.2 Time-Dependent, Progressive Failure......Page 75
Fatigue Crack Growth......Page 76
Example 15.5......Page 77
15.4.1 Solder Joint Reliability......Page 78
15.4.2 Wirebond Reliability......Page 81
Example 15.6......Page 103
15.4.4 Semiconductor Devices......Page 85
15.5 Failure Analyses of Electronic Packages......Page 86
15.6 Thermal Management......Page 88
Example 15.7......Page 89
15.7 Concluding Remarks......Page 93
References......Page 94
16.1.1 Safety Philosophy of Electronic Equipment......Page 73
Electric Shock and Energy Hazard......Page 23
Heat, Fire, and Tracking Hazards......Page 24
Sonic and Ultrasonic Pressure Hazards......Page 25
Ergonomics Hazards......Page 26
16.2 Compliance Assessment Procedures......Page 181
16.1.3 International Regulations Mandating Product Safety......Page 27
16.1.4 Standards......Page 28
16.1.5 Criteria for Compliance, Required Documentation......Page 29
Co-Firing......Page 30
16.2.2 Safety and EMC Tests......Page 33
Dielectric Strength......Page 34
Leakage Currents......Page 35
Abnormal Operation and Fault Condition......Page 36
Radio Frequency Interference and Immunity......Page 37
Other EMC Tests......Page 38
16.3.1 Selection of Components......Page 39
Power Supply Cord Set......Page 41
Fuses/Fuseholders......Page 42
Switches......Page 43
Appliance Inlet, Line Filters, Capacitors, Resistors, Transient Voltage Surge Suppressors, and Po.........Page 44
Thermoplastic Materials......Page 45
16.3.2 Construction Details......Page 46
Enclosures......Page 47
Earthing (Grounding)......Page 48
16.3.4 Marking Requirements......Page 49
16.3.5 Documentation Requirements......Page 50
16.4.1 CE Marking......Page 52
16.4.1.1 Procedure for CE Marking......Page 53
Low Voltage Directive......Page 54
Medical Devices Directive......Page 55
16.4.2 UL Mark......Page 56
16.4.3 Reciprocal Certification Scheme......Page 57
Mutual Recognition Agreements......Page 58
16.5 Appendix......Page 59
Solder Cream......Page 122
Base Material......Page 9
Adhesion Failure......Page 118
Chip scale package, chip size package or CSP......Page 10
Conductor......Page 11
DIPs......Page 12
Critical Defect......Page 22
Fault Simulation......Page 13
HDI......Page 14
Paste Flux......Page 120
Laser Trimming......Page 15
Multichip Integrated Circuit......Page 16
Printed Board Assembly......Page 17
Socket Contact......Page 18
TCP......Page 19
µ......Page 20