✦ LIBER ✦
The Effects of Si Submounts Containing Cu Thermal Vias on the Heat-Dissipation Characteristics of a High-Power Light-Emitting Diode Package
✍ Scribed by Kim, M. Y.; Jeong, T.; Ha, J. S.; Oh, T. S.
- Book ID
- 121573459
- Publisher
- Springer US
- Year
- 2013
- Tongue
- English
- Weight
- 529 KB
- Volume
- 43
- Category
- Article
- ISSN
- 0361-5235
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