The effect of wirebond geometry and die setting on wire sweep : A. A. O. TAY, K. A. YEO and J. H. WU. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 201 (February 1995)

• Book ID: 103288068
• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 115 KB
• Volume: 36
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(96)84453-2