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The effect of water desorption and organosilane coupling agents on the adhesion of poly(p-xylylene) films to a silicon wafer surface

✍ Scribed by P. K. Lightfoot; J. Stejny


Book ID
110313669
Publisher
Springer US
Year
2001
Tongue
English
Weight
270 KB
Volume
12
Category
Article
ISSN
0957-4522

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