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The effect of the nature and structure of organic components of copper-plating sulfate bath on the electroplating kinetics, structure, and physicomechanical properties of coatings

✍ Scribed by Skibina, L. M.; Burdina, E. I.; Kuzharov, A. A.; Sokolenko, A. I.

No coin nor oath required. For personal study only.

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