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The effect of residual stress on the SCC using ANSYS

โœ Scribed by Jun-Young Nam; Duck-hee Seo; Sang-yun Lee; Woong-Ki Hwang; Bo-Young Lee


Publisher
Elsevier
Year
2011
Tongue
English
Weight
486 KB
Volume
10
Category
Article
ISSN
1877-7058

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The effect of curing history on the residual stress behaviors in semiflexible structure poly(4,4ะˆ-oxydiphenylene pyromellitimide) (PMDA-ODA) and rigid structure poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA) polyimide was investigated. Depending upon the curing history and different structure