The effect of postbake treatment on whisker growth under high temperature and humidity conditions on tin-plated Cu substrates

✍ Scribed by Kyung-Seob Kim; Jin-Hyeok Kim; Sung-Won Han

• Book ID: 113791627
• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 648 KB
• Volume: 62
• Category: Article
• ISSN: 0167-577X
• DOI: 10.1016/j.matlet.2007.10.027