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The effect of mechanical treatment on the thermal behaviour of the Cu2-nTe phase

✍ Scribed by R. Blachnik; U. Walbrecht

Publisher
Elsevier Science
Year
1983
Tongue
English
Weight
86 KB
Volume
64
Category
Article
ISSN
0040-6031

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## Abstract The realtime evolution of stress during deposition of Cu/Au and Au/Cu bilayers was studied by an in‐situ curvature measurement optical technique and annealing in the temperature range from room temperature to 400 Β°C. The Au/Cu and Cu/Au bilayers attached to silicon substrate with total