✦ LIBER ✦

The effect of corrosion on the performance of high speed multi-chip module interconnects

✍ Scribed by Lee Guan; Aris Christou; David F. Barbe

Publisher: John Wiley and Sons
Year: 2000
Tongue: English
Weight: 132 KB
Volume: 16
Category: Article
ISSN: 0748-8017
DOI: 10.1002/1099-1638(200007/08)16:4<255::aid-qre331>3.0.co;2-z

No coin nor oath required. For personal study only.

✦ Synopsis

A new methodology to incorporate the effect of failure mechanisms into interconnection circuit performance simulation is developed. The effect of corrosion on the performance of high speed multi-chip module interconnects has been investigated. The method presented in this paper may be applied to the study of other failure mechanisms through the simulation of the gradual degradation of signal integrity.

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