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The Effect of Contact Surface Conditions on Reed Bouncing

โœ Scribed by Miedzinski, B.; Okraszewski, Z.; Hajducka, D.; Zolnierczyk, T.


Book ID
117911542
Publisher
IEEE
Year
1985
Tongue
English
Weight
971 KB
Volume
8
Category
Article
ISSN
0148-6411

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In droplet-based manufacturing processes, such as drop-wise rapid prototyping, solder bumping and spray forming, the bouncing phenomenon adversely affects the quality of the deposit. This study investigates the effect of surface roughness on bouncing of liquid metal droplets from the substrate. An a