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The effect of area ratio on the flow distribution in liquid cooling module manifolds for electronic packaging

✍ Scribed by Steve H. Choi; Sehyun Shin; Young I. Cho

Publisher: Elsevier Science
Year: 1993
Tongue: English
Weight: 465 KB
Volume: 20
Category: Article
ISSN: 0735-1933
DOI: 10.1016/0735-1933(93)90050-6

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