The rheological characterization of a wide variety of materials used in computer hardware is described. The materials and applications presented include liquid crystal polymers for components, solder paste for surface mounting of integrated circuits, screen printable polyimide for dielectric pattern
The distinctive CFD challenges of computational rheology
β Scribed by K. Walters; M. F. Webster
- Publisher
- John Wiley and Sons
- Year
- 2003
- Tongue
- English
- Weight
- 250 KB
- Volume
- 43
- Category
- Article
- ISSN
- 0271-2091
- DOI
- 10.1002/fld.522
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