✦ LIBER ✦

The development of automated solder bump inspection using machine vision techniques

✍ Scribed by Wen-Yen Wu, Ching-Wen Hung, Wen-Bin Yu

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

The automated inspection of lace using m

✍ C. Sanby; L. Norton-Wayne; R. Harwood 📂 Article 📅 1995 🏛 Elsevier Science 🌐 English ⚖ 843 KB

Quantitative automated inspection of sta

✍ Ehsan Asoudegi 📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 222 KB

The application of machine vision to the

✍ Mark Bradshaw 📂 Article 📅 1995 🏛 Elsevier Science 🌐 English ⚖ 543 KB

Machine vision for automated visual insp

✍ P. Tantaswadi; J. Vilainatre; N. Tamaree; P. Viraivan 📂 Article 📅 1999 🏛 Elsevier Science 🌐 English ⚖ 278 KB

Post-Slicing Inspection of Silicon Wafer

✍ Te-Hsiu Sun; Chung-Hao Tang; Fang-Chih Tien 📂 Article 📅 2011 🏛 IEEE 🌐 English ⚖ 667 KB

SPIE Proceedings [SPIE Electronic Imagin

✍ Norton-Wayne, Leonard; Bradshaw, Mark; Sanby, Christopher; Braggins, Donald W. 📂 Article 📅 1993 🏛 SPIE ⚖ 587 KB