The conduction mechanism of polymer–filler particles
✍ Scribed by Shin'nosuke Miyauchi; Eiki Togashi
- Publisher
- John Wiley and Sons
- Year
- 1985
- Tongue
- English
- Weight
- 752 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0021-8995
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The addition of fillers can significantly change the mechanical characteristics of a material. In this paper, a general, mechanistic model is established to determine the moduli, relaxation moduli, break strengths, and break strains for polymer films containing liquid and solid micro fillers. Based
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