โ Scribed by Noboru Kubota; Toru Horikoshi; Eiichi Sato
No coin nor oath required. For personal study only.
The co-deposition behavior of a trace of copper and zinc as an impurity in cyanide baths for silver plating was studied by means of a radioactive tracer . The authors selected "CuCN and "Zn(CN I, as a labelled compound and added it to the cyanide baths for silver plating .
Each amount of copper and zinc co-deposited with silver increased with increasing copper and zinc concentration in silver plating baths and temperature . It was found that the co-deposition of copper and zinc depended on cathode potentials and was not diffusion-determining. The co-deposition of copper abruptly increased in the high current density range. In the potential range Cu co-deposition is observed with Cu reversible potential through limiting current of silver deposition, and evolution of hydrogen . At low current density, Cu and Zn co-deposition are saturated at about 6400A thickness of electrodeposiled silver and occluded in the etectrodeposited silver, but are not incorporated within the crystal structure of silver . The surface of the silver electrodeposits is not smooth and coarse structure is observed on it .
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