𝔖 Bobbio Scriptorium
✦   LIBER   ✦

The challenge of reducing both airframe weight and manufacturing cost

✍ Scribed by Jens Hinrichsen; Cesar Bautista


Book ID
108489449
Publisher
Elsevier Science
Year
2001
Weight
217 KB
Volume
3
Category
Article
ISSN
1290-0958

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES


Thinwall: reducing the weight, size and
✍ Kurt Weiss πŸ“‚ Article πŸ“… 1999 πŸ› Elsevier Science βš– 243 KB

In recent design cycles, the average thickness for many portable electronic equipment applications made from engineering thermoplastics has dropped from 2.0 mm to 1.5 mm. Thinwall technology developed by GE Plastics can be used to reduce the wall thickness even more, which boosts productivity and pe