The behavior of a crack near a low-angle grain boundary
โ Scribed by Gregory R. Miller
- Publisher
- Springer Netherlands
- Year
- 1986
- Tongue
- English
- Weight
- 462 KB
- Volume
- 31
- Category
- Article
- ISSN
- 1573-2673
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โฆ Synopsis
This paper presents the results of a simplified analysis of the behavior of a microcrack in the vicinity of a low-angle grain boundary. Combining the well-known dislocation model of low angle grain boundaries developed by Burgers, Read and Shockley, and Cottrell (see e.g. [1]) with the crack/dislocation interaction solution developed by Atkinson [2] and Lo [3], a series expression is obtained for the stress intensity factors at the tip of a crack near such a boundary. The main purpose of the analysis is to introduce a grain boundary model which includes aspects of the physical microstructure at the boundary. Results are computed and discussed for a variety of geometrical configurations, with the intent of developing understanding of the role of such boundaries in fracture processes at the micro-level.
๐ SIMILAR VOLUMES
We investigated the migration of a symmetric tilt, low-angle grain boundary (LAGB) under applied shear stress in the presence of extrinsic dislocations. The results demonstrate that there is a threshold stress for the LAGB to depin from extrinsic dislocations. Below the threshold stress, the LAGB re
Ahatraet-A study has been made using transmission electron microscopy of the pinning of grain boundaries in aluminium during grain growth by fine dispersions of alumina particles. The boundary parameters have been determined with precision and the pinning effects measured using an approach due to As