✦ LIBER ✦
The Application of Barrierless Metallization in Making Copper Alloy, Cu(RuHfN), Films for Fine Interconnects
✍ Scribed by C.H. Lin; W.K. Leau; C.H. Wu
- Book ID
- 107456982
- Publisher
- Springer US
- Year
- 2010
- Tongue
- English
- Weight
- 582 KB
- Volume
- 39
- Category
- Article
- ISSN
- 0361-5235
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