The addition of surfactant to slurry for polymer CMP: effects on polymer surface, removal rate and underlying Cu

✍ Scribed by Jan M. Neirynck; G.-R. Yang; Shyam P. Murarka; Ronald J. Gutmann

• Book ID: 114086097
• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 398 KB
• Volume: 290-291
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/s0040-6090(96)09033-5