✦ LIBER ✦
Texture and strain in narrow copper damascene interconnect lines: An X-ray diffraction analysis
✍ Scribed by B. Kaouache; S. Labat; O. Thomas; S. Maitrejean; V. Carreau
- Book ID
- 104052015
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 638 KB
- Volume
- 85
- Category
- Article
- ISSN
- 0167-9317
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