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Testing materials for use in electroless plating


Book ID
123074308
Publisher
Elsevier Science
Year
2000
Tongue
English
Weight
181 KB
Volume
98
Category
Article
ISSN
0026-0576

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Using electroless plating Cu technology
โœ Po-Tsun Liu; Yi-Teh Chou; Chih-Yu Su; Hung-Ming Chen ๐Ÿ“‚ Article ๐Ÿ“… 2010 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 761 KB

This study investigates the feasibility of using electroless plating (ELP) technology to manufacture copper (Cu) gate electrodes in thin film transistors (TFTs). The problem of poor adhesion between Cu and glass substrates is overcome by introducing ELP nickel-phosphorus (NiP) layers. Copper pattern