✦ LIBER ✦
Test structure assembly for bump bond yield measurement on high density flip chip technologies
✍ Scribed by M. Ullán; M. Lozano; M. Chmeissani; G. Blanchot; E. Cabruja; J. García; M. Maiorino; R. Martínez; G. Pellegrini; C. Puigdengoles
- Book ID
- 108210602
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 324 KB
- Volume
- 46
- Category
- Article
- ISSN
- 0026-2714
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