Tensile creep study of copper with alumina dispersions prepared by high rate physical vapour deposition

✍ Scribed by Kumar Sankar Majumder

• Publisher: Elsevier Science
• Year: 1977
• Tongue: English
• Weight: 469 KB
• Volume: 45
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/0040-6090(77)90240-1