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Temptronic ThermoChuck meets standards


Publisher
Elsevier Science
Year
1997
Tongue
English
Weight
183 KB
Volume
28
Category
Article
ISSN
0026-2692

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โœฆ Synopsis


Temptronic ThermoChuck meets standards

Shown at the SEMICON Europa exhibition, the Temptronic Model TPO3200 ThermoChuck system for wafer testing from -65 to +150ยฐC meets international standards. It complies with international and EC standards (CE Mark, VDE, UL, SEMI and CSA) with improved ease of use and performance. An efficient cooling system provides for low temperature testing of wafers, chips and hybrids down to -65OC with the Controlled Environment Enclosure accessory for moisture-fiee probing at lower temperatures.


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