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Temporal velocity distribution of positive and negative ions incident on a wafer in a pulsed two-frequency capacitively coupled plasma in CF/sub 4//Ar for SiO/sub 2/ etching

✍ Scribed by Yagisawa, T.; Makabe, T.


Book ID
127224742
Publisher
IEEE
Year
2003
Tongue
English
Weight
604 KB
Volume
31
Category
Article
ISSN
0093-3813

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