✦ LIBER ✦
Temperature distribution in IC plastic packages in the reflow soldering process : Hideo Miura, Asao Nishimura, Sueo Kawai and Wataru Nakayama. IEEE Trans. Comp. Hybrids Manufact. Tech. 11(4), 499 (December 1988)
- Book ID
- 103282202
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 140 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0026-2714
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