✍ Scribed by Yu, Zhao-Yuan ;Jiang, Qing-Wei ;Li, Xiao-Wu
No coin nor oath required. For personal study only.
The plastic deformation and damage behaviour of ultrafine‐grained (UFG) copper produced by equal channel angular pressing were investigated at temperatures ranging from room temperature to 573 K under uniaxial compression. It was found that the testing temperature has a strong effect on the corresponding mechanical behaviour of UFG copper. For example, the compressive yield stress and steady flow stress of UFG copper decease generally with increasing temperature. In the case of temperatures below recrystallization, an enhanced early‐stage strain softening was observed with increasing temperature. Compressive deformation damage features of UFG copper are also strongly dependent on the temperature. Small‐ and large‐scale cracks were observed to form along the shear bands at room temperature, whereas microvoids or cracks were found to nucleate at grain boundaries at temperatures above recrystallization. At in‐between temperatures, some microvoids with various sizes were detected along the shear direction. Such temperature‐dependent deformation and damage behavior are closely related with the corresponding microstructural changes after compressive deformation. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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