Reliability studies of barrier layers fo
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H.S. Nguyen; Z.H. Gan; Zhe Chen; V. Chandrasekar; K. Prasad; S.G. Mhaisalkar; Ni
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Article
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2006
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Elsevier Science
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English
⚖ 405 KB
Electromigration and electrical breakdown are two of the most important concerns in the reliability of modern electronic devices. The electromigration lifetimes and electrical breakdown field (E BD ) in single damascene copper lines/ porous polyarylene ether (PAE) dielectric with different diffusion