Technology and reliability of thermal SiO2 layers as used for passivating silicon power devices

Application of chemical-mechanical polis

Application of chemical-mechanical polishing for planarizing of silicon nitride passivation layers used in high power III-V laser devices

✍ Jiang Wei 📂 Article 📅 2006 🏛 John Wiley and Sons 🌐 English ⚖ 322 KB 👁 1 views

## Abstract Chemical‐mechanical polishing (CMP) allows the planarization of wafers with thin layer at its surface. Subject of this investigation was to apply CMP for planarizing silicon nitride (Si~3~N~4~) passivation layer in high power III‐V laser devices, which remained in the structure as the i