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System in Package Feasibility Process

✍ Scribed by Stoppino, P.P.; Conci, A.; Lessio, T.; Ferrara, D.

Book ID
114564957
Publisher
IEEE
Year
2009
Tongue
English
Weight
917 KB
Volume
97
Category
Article
ISSN
0018-9219

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Because of its large dimension and its high level of integration, the PICS (Passive Integration Connecting Substrate) developed by NXP prone to top to bottom metal short (TBMS) failure during temperature cycling test. Several options of process modifications as well as new design rules and stress re