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Synthesis and Thermal and Wetting Properties of Tin/Silver Alloy Nanoparticles for Low Melting Point Lead-Free Solders

โœ Scribed by Jiang, Hongjin; Moon, Kyoung-sik; Hua, Fay; Wong, C. P.


Book ID
118004225
Publisher
American Chemical Society
Year
2007
Tongue
English
Weight
288 KB
Volume
19
Category
Article
ISSN
0897-4756

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