Synthesis and characterization of water-soluble polymeric adhesion promoter for epoxy resin/copper joints

✍ Scribed by S. M. Song; K. Cho; C. E. Park; H. K. Yun; S. Y. Oh

• Publisher: John Wiley and Sons
• Year: 2002
• Tongue: English
• Weight: 310 KB
• Volume: 85
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/app.10837