✦ LIBER ✦
Synergetic effects of wafer rigidity and retaining-ring parameters on contact stress uniformity in chemical mechanical planarization
✍ Scribed by Ian Hu; Tian-Shiang Yang; Kuo-Shen Chen
- Publisher
- Springer
- Year
- 2011
- Tongue
- English
- Weight
- 896 KB
- Volume
- 56
- Category
- Article
- ISSN
- 0268-3768
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