Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50μm Sn–Ag–Cu solder bumps

✍ Scribed by Huang, M.L.; Yang, F.; Zhao, N.; Yang, Y.C.

• Book ID: 122261286
• Publisher: Elsevier Science
• Year: 2014
• Tongue: English
• Weight: 978 KB
• Volume: 602
• Category: Article
• ISSN: 0925-8388
• DOI: 10.1016/j.jallcom.2014.03.047