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Switch monitoring—The new generation of monitoring for local area networks

✍ Scribed by Dan Romascanu; Itai E. Zilbershtein

Publisher
Institute of Electrical and Electronics Engineers
Year
2002
Tongue
English
Weight
417 KB
Volume
4
Category
Article
ISSN
1089-7089

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## Abstract A new apparatus is described whereby the thermal behavior, including the deformation temperature, of a thermoplastic material may be obtained. The apparatus is intended to replace ASTM procedure No. D648‐56 and has several advantages over that procedure. Thermal behavior of several comm