Sustained Immersion Tin Deposition on Copper from Choline Chloride Based Aqueous Solution without Reducing Agent

✍ Scribed by Wang, Y.; He, J.; Wang, W.; Naotoshi, M.; Chen, Z.

• Book ID: 125550704
• Publisher: The Electrochemical Society
• Year: 2013
• Tongue: English
• Weight: 687 KB
• Volume: 160
• Category: Article
• ISSN: 0013-4651
• DOI: 10.1149/2.005308jes