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Surface studies of interconnecting zones for selective-area sealing of hybrid microcircuits using isothermal solidification process

✍ Scribed by P.K Khanna; S.K Bhatnagar; W Gust


Book ID
117358759
Publisher
Elsevier Science
Year
1999
Tongue
English
Weight
185 KB
Volume
40
Category
Article
ISSN
0167-577X

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