Surface modification and metallization of polyimide using gold colloids as a seed layer

✍ Scribed by Yong Kong; Jianqun Shao; Wenchang Wang; Zhidong Chen; Haixia Chu

• Publisher: John Wiley and Sons
• Year: 2009
• Tongue: English
• Weight: 347 KB
• Volume: 111
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/app.29188