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Surface diffusion of copper on tantalum substrates by Ostwald ripening

✍ Scribed by F. Fillot; Zs. Tőkei; G.P. Beyer

Book ID
108279449
Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
740 KB
Volume
601
Category
Article
ISSN
0039-6028

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