## Abstract Surface modification of polyimide films such as Kapton E(N) and Upilex S by argon plasma was investigated because of the enhanced adhesive strength with sputtered copper. Peel tests demonstrated this improvement, with a peel strength of 0.7 and 1.2 g/mm for unmodified Kapton E(N) and Up
Surface characterisation of plasma treated flexible substrates for waveguide-on-flex application
✍ Scribed by Tze Yang Hin; Changqing Liu; Paul P. Conway
- Publisher
- Elsevier Science
- Year
- 2009
- Tongue
- English
- Weight
- 866 KB
- Volume
- 203
- Category
- Article
- ISSN
- 0257-8972
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✦ Synopsis
This paper reports the physical and chemical effects of argon, nitrogen and oxygen plasma treatments on the surface properties of flexible circuit materials. Both KaptonHN™ and Vecstar™ films selected as optical flexible substrates under plasma irradiation were studied by atomic force microscope (AFM), contact angles, X-ray photoelectron spectroscopy (XPS) and time-of-flight secondary ion mass spectrometry (ToF-SIMS). The etch rate enhancement of the polymeric materials is more pronounced in oxygen plasma than in argon or nitrogen plasma. The increases of surface functional groups (-COOH, -CNOH) of plasma-modified polymer films are correlated with the increased presence of polar component in surface free energy. While the plasma treatment on KaptonHN™ substrates have been widely discussed in literature, the detailed characterisation of both pristine and different plasma surface modified Vecstar™ films is reported and compared for the first time.
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