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Surface and grain boundary scattering studied in beveled polycrystalline thin copper films

✍ Scribed by W. Zhang; S. H. Brongersma; T. Clarysse; V. Terzieva; E. Rosseel; W. Vandervorst; K. Maex

Book ID: 126487398
Publisher: AVS (American Vacuum Society)
Year: 2004
Tongue: English
Weight: 648 KB
Volume: 22
Category: Article
ISSN: 0734-211X
DOI: 10.1116/1.1771666

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