Abstract
A series of poly(amide imide)–poly(dimethylsiloxane) (PDMS) nanocomposites were fabricated through the reaction of poly(amide imide), epoxysilane (coupling agent), and diethoxydimethylsilane (DEDMS) via a sol–gel process. Nanocomposite films were obtained through the hydrolysis and condensation of DEDMS in poly(amide imide) solutions. The existence of the condensation product of DEDMS in the poly(amide imide) matrix was confirmed with Fourier transform infrared (FTIR). The concentration of PDMS on the surface of the poly(amide imide) matrix was observed through a comparison of FTIR and attenuated total reflection spectra. The contact angle of the poly(amide imide)–PDMS composites increased more than 40° with respect to that of pure poly(amide imide). The alternating‐current (ac) breakdown strength was obtained through the measurement of the ac breakdown voltage at the temperature of liquid nitrogen. As the PDMS concentration in poly(amide imide) increased, the characteristics of the insulation breakdown improved greatly. The best ac breakdown strength was observed in a poly(amide imide)–epoxysilane (30 wt %) nanocomposite with 30 wt % PDMS. The samples at the temperature of liquid nitrogen were brittle, as in a glassy state. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 342–347, 2004